Closed-loop manufacturing for superior stencil quality and solder paste application. The Solder Paste Inspection add-on for Process Preparation enables solder paste print process analysis against stencil designs, ensuring precision and repeatability. By integrating real-time advanced data analytics, this optional package improves stencil quality, optimizes paste deposition, and enhances paste printer setup, leading to higher first-pass yields and fewer defects in the critical paste printing process.
Key Features
- Closed-loop stencil-to-paste validation:
Compares solder paste inspection (SPI) data with stencil designs to detect inconsistencies and guide process improvements.
- Advanced data analytics for process optimization:
Uses real-time inspection insights to refine stencil designs and adjust print parameters before defects occur.
- Seamless digital thread integration:
Aligns stencil design, inspection results, and process corrections in a closed-loop environment, ensuring data-driven decision-making.
- Higher first-pass yield & reduced waste:
Enhances solder joint quality by proactively preventing defects at the printing stage, reducing rework and material waste.
Benefits of the Process Preparation X Closed-loop Manufacturing add-on:
- Optimize the print process by feeding back SPI results analysis
- SPI log files are read by the CLM add-on to provide insight into how to adjust the print process to reduce solderability defects