Process Preparation X

Closed-loop Manufacturing add-on

Option that allows solder paste inspection advanced data analytics against the solder stencil, to further improve the quality of your stencils.

Screen shot of Process Preparation X Closed-loop Manufacturng Addon software that enables advanced data analytics to improve the quality of stencils

Process Preparation X Closed-loop Manufacturing add-on

Closed-loop manufacturing for superior stencil quality and solder paste application. The Solder Paste Inspection add-on for Process Preparation enables solder paste print process analysis against stencil designs, ensuring precision and repeatability. By integrating real-time advanced data analytics, this optional package improves stencil quality, optimizes paste deposition, and enhances paste printer setup, leading to higher first-pass yields and fewer defects in the critical paste printing process.

Key Features

  • Closed-loop stencil-to-paste validation:

    Compares solder paste inspection (SPI) data with stencil designs to detect inconsistencies and guide process improvements.

  • Advanced data analytics for process optimization:

    Uses real-time inspection insights to refine stencil designs and adjust print parameters before defects occur.

  • Seamless digital thread integration:

    Aligns stencil design, inspection results, and process corrections in a closed-loop environment, ensuring data-driven decision-making.

  • Higher first-pass yield & reduced waste:

    Enhances solder joint quality by proactively preventing defects at the printing stage, reducing rework and material waste.

Benefits of the Process Preparation X Closed-loop Manufacturing add-on:

  • Optimize the print process by feeding back SPI results analysis
  • SPI log files are read by the CLM add-on to provide insight into how to adjust the print process to reduce solderability defects

Why Choose the Solder Paste Inspection add-on?

With increasing demand for zero-defect manufacturing, ensuring solder paste accuracy is critical. The closed-loop manufacturing approach of the Clsoed-loop Manufacturing add-on provides manufacturers with improved process control, reducing errors, cutting costs, and improving production efficiency.

Refine your stencil quality, optimize solder paste application, drive manufacturing excellence.

About Process Preparation X

Process Preparation X is a comprehensive process planning solution designed to accelerate high-mix, low-volume electronics production. By leveraging advanced electronic assembly collaboration, it enables seamless global engineering while reducing complexity and the total cost of ownership. With Process Preparation X, manufacturers gain a secure, constantly improving, future-proof technology suite that streamlines workflows, minimizes existing manual errors, and adapts effortlessly to any shop floor operation.

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