SIMCENTER
Harvey Rosten Award for Excellence
The Harvey Rosten Award for Excellence commemorates Harvey's achievements in thermal analysis, and aims to encourage innovation and excellence in this field. The award is presented annually in the form of a plaque and a prize equivalent of $1000.
About Harvey Rosten
Harvey Rosten, a physics graduate, co-founded Flomerics in 1989. As Technical Director, he led Simcenter Flotherm's core solver development. Initiating Flomerics' package-level thermal initiative in 1992, he succeeded with DELPHI by 1996, revolutionizing global electronic systems' thermal analysis. He passed away on June 23, 1997, posthumously receiving the 1998 IEEE SEMI-THERM THERMI Award.
About the award
Summary of criteria for award consideration and details on award presentation.
To be eligible, the work has to be:
- Original
- In the public domain. This includes:
- Papers presented at conferences papers appearing in journals other original work
- Documented in some publicly available form, such as a research thesis
- Made publicly available during the 12 months prior to the cutoff date for nominations
- the cut-off date for nominations is October 15th each year
- Relevant - the work should:
- Be primarily concerned with advances in thermal analysis or thermal modeling of electronics equipment or components, including experiments aimed specifically at validating numerical models
- Have a clear application to practical electronics thermal design
- Favorable consideration will be given to work that demonstrates:
- Insight into the physical processes affecting the thermal behavior of electronics components/parts/system an innovative approach to embodying this understanding practical application of the advance
The award will be presented to the author. In the case of co-authored papers, the leading author will usually be presented with the award. This year’s award will be presented at the IEEE SEMI-THERM Symposium. For more information on the SEMI-THERM Symposium, visit the SEMI-THERM home page.
The presentation is made to the author. In the case of co-authored papers, the presentation would normally be made to the leading author. This year’s award will be presented at the IEEE SEMI-THERM Symposium. For more information on the SEMI-THERM Symposium visit the SEMI-THERM home page.
Sponsorship
The Harvey Rosten Award for Excellence is supported by Simcenter simulation and test solutions, Siemens Digital Industries Software in Harvey’s honor.
Eligible works are scored out of 10 against each of the five following dimensions:
- Context - work in thermal analysis, thermal modeling or thermal testing of electronics components, parts and systems, including insight into the physical processes affecting thermal behavior and experiments aimed specifically at validating and calibrating numerical models
- Pragmatic - the work takes a pragmatic approach that demonstrates clear application to practical electronics design
- Innovation - work is innovative in embodying an understanding of thermal analysis, thermal modeling, thermal design or test equipment
- Broad applicability - work will benefit to the broad electronics thermal community, with the potential for the results to become accessible within a foreseeable timeframe
- Accessibility - work is documented using correct English grammar, is easily readable, well structured and reasoned
Dr. Clemens Lasance, Principal Scientist, Philips Research, Retired
Dr. Robin Bornoff, Siemens Digital Industries Software, (Chairperson)
Dr. John Parry, Siemens Digital Industries Software
Dr. Ross Wilcoxon, Sr Technical Fellow, Collins Aerospace
Dr. Cathy Biber, Principal Thermal Engineer, Yotta Energy
Dr. Jim Wilson, Engineering Fellow, Raytheon
Papers by Harvey Rosten
Overview of papers in the field of thermal analysis of electronics equipment and the thermal modeling of electronics parts and packages to which Harvey Rosten was a contributor.
Final report to SEMI-THERM XIII on the European-funded project DELPHI - the development of libraries and physical models for an integrated design environment
H. Rosten
Evening Tutorial at 13th SEMI-THERM Symp., in Proc. 13th SEMI-THERM Symp., pp.73-91, Austin TX, January 28-30 1997
The development of component-level thermal compact models of a C4/CBGA interconnect technology - the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors
John Parry, Harvey Rosten and Gary B. Kromann
IEEE CPMT transactions, part A, vol. 20 no 1, pp.1043-112, March 1998
Thermal modeling of the Pentium processor package
In proc. 44th ECTC conference, pp 421-428, Washington DC, 1-4 May 1994
The development of libraries of thermal models of electronic components for an integrated design environment
H. I. Rosten and C. J. M. Lasance
Proc. IEPS conference, pp.138-147, Atlanta, GA, 26-28 September 1994
A novel approach for the thermal characterization of electronic parts
C. Lasance, H. Vinke, H. Rosten and K-L. Weiner
Proc. 11th SEMI-THERM Symposium, pp.1-9, San Jose, CA, February 1995
DELPHI - the development of libraries of physical models of electronic components for an
integrated design
H. I. Rosten and C. J. M. Lasance
Chapter 5 in model generation in electronic design, Klewer Press, May 1995. ISBN: 0-7923-9568-9
Development, validation and application of a thermal model of a plastic quad flat pack
H. Rosten, J. Parry, S. Addison, R. Viswanath, M. Davies and E. Fitzgerald
Proc. 45th ECTC, pp.1140-1151, Las Vegas AZ, May 1995
DELPHI - a status report on the ESPRIT-funded project for the creation and validation of thermal models of electronic parts
H. Rosten
In thermal management of electronic systems II, Proc. of EUROTHERM seminar 45, pp.17-26, Leuven, September 1995. ISBN: 0-7923-4612-2
Thermal characterization of electronic devices with boundary condition independent compact models
C. Lasance, H. Vinke and H. Rosten,
IEEE CPMT transactions, part A, vol. 14 No 4, pp.723-731, December 1995
Winning papers
Overview of awarded papers and authors that showcased innovation and advancement in the field of thermal analysis of electronics.
Szilárd Zsigmond Szőke, Henrik Sebők
Applicability of JESD51-14 to Clip-bonded, Discrete Power Devices
29th THERMINIC workshop, Budapest, Hungary, September 2023
Antonio Pio Catalano, Ciro Scognamillo, Francesco Piccirillo, Pierluigi Guerriero, Vincenzo D'Alessandro, Lorenzo Codecasa
Analysis of the Thermal Behavior of Li-Ion Pouch Battery Cell – Part II: Circuit-based Modeling for Fast and Accurate Thermo-Electrochemical Simulation
Sujay Singh, Joe Proulx and Andras Vass-Varnai
Measuring the RthJC of power semiconductor components using short pulses
27th THERMINIC workshop, Berlin, Germany, September 2021
Sajad Ali Mohammadi and Tim Persoons
A novel linear air amplifier technology to replace rotary fans in data center server rack cooling
26th THERMINIC workshop, Berlin, Germany, September 2020
Baver Ozceylan, Boudewijn R. Haverkort, Maurits de Graaf and Marco E. T. Gerards
A generic processor temperature estimation method
25th THERMINIC workshop, Lecco, Italy, September 2019
James W. VanGilder, Christopher M. Healey, Michael Condor, Wei Tian and Quentin Menusier
A compact cooling-system model for transient data center simulations
34th SEMI-THERM conference, San Jose, March 2018
János Hegedüs, Gusztáv Hantos and András Poppe
Lifetime isoflux control of LED-based light sources
23rd THERMINIIC workshop, Amsterdam, NL, September 2017, 2016
Robin Bornoff, John Wilson, and John Parry
Subtractive design: a novel approach to heatsink improvement
32nd SEMI-THERM Symposium, San Jose, CA USA, March 2016, 2015
Lorenzo Codecasa, Vincenzo d’Alessandro, Alessandro Magnani and Niccolò Rinaldi
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction
31st THERMINIC Workshop, Paris, France, October 2015
Cameron Nelson, Jesse Galloway, and Phillip Fosnot
Extracting TIM properties with localized transient pulses
30th SEMI-THERM conference at San Jose, CA in March 2014, 2013
Wendy Luiten
Solder joint lifetime of rapid cycled LED components
19th THERMINIC conference at Berlin Germany, in September 2013, 2012
András Poppe
A step forward in multi-domain modeling of power LEDs
28th SEMI-THERM Symposium at San Jose, CA, in March 2012 2011
Alfonso Ortega, K.S.Harinadh Potluri and Bryan Hassel
An investigation of multi-layer mini-channel heat sinks with channel geometric scale variation suggested by constructal scaling principles
27th SEMI-THERM Symposium at San Jose, CA, in March 2011
Dirk Schweitzer
The junction-to-case thermal resistance - a boundary condition dependent thermal metric 26th SEMI-THERM Symposium at San Jose, CA, in March 2010, 2009
Suresh V. Garimella and Tannaz Harirchian
Boiling heat transfer and flow regimes in microchannels - a comprehensive understanding 15th THERMINIC workshop at Leuven, Belgium, in October 2009 2008
R. J. Linderman, T. Brunschwiler, U. Kloter, H. Toy and B. Michel
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
23rd SEMI-THERM Symposium at San Jose, CA, in March 2007 2007
Raghav Mahalingam and Ari Glezer
For their pioneering work in synthetic jets (microjets) for electronics cooling applications over a number of years, described in a number of conference papers, journal papers and magazine articles.
Dan S. Kercher, Jeong-Bong Lee, Oliver Brand, Mark G. Allen, and Ari Glezer
Microjet cooling devices for thermal management of electronics
IEEE transactions on components and packaging technologies, vol. 26, No. 2, June 2003, pp. 359 - 366
Raghav Mahalingam, Nicolas Rumigny and Ari Glezer
Thermal management using synthetic jet ejectors
IEEE transactions on components and packaging technologies, vol. 27, No. 3, Sept. 2004, pp. 439 - 444
Raghav Mahalingam
Modeling of synthetic jet ejectors for electronics cooling
Proceedings of 23rd IEEE SEMI-THERM Symposium, 18-22 March 2007, pp. 196 - 199
Raghav Mahalingam, Sam Heffington, Lee Jones and Randy Williams
Synthetic jets for forced air cooling of electronics
Electronics cooling, vol. 13, no. 2, May 2007, pp. 12-18
Peter E. Raad, Pavel L. Komarov, and Mihai G. Burzo
A coupled thermo reflectance thermography experimental system and ultra-fast adaptive computational engine for the complete thermal characterization of three-dimensional electronic devices validation.
THERMINIC Workshop at Nice, Côte d'Azur, France in September 2006, 2005
Clemens Lasance
Exceptional Award, made in recognition of his pioneering contributions over two decades to understanding and predicting the thermal behavior of electronic equipment in 2004
Bruce Guenin
For his many published contributions in the field of electronics thermal management, including championing thermal standards through the JEDEC JC15.1 committee, of which he is chairman. Notably, these include the “JEDEC two-resistor compact model standard” and the “JEDEC DELPHI compact model guideline”, both of which were being balloted by the committee at the time of the award in 2003
Heinz Pape, Dirk Schweitzer, John H.J. Janssen, Arianna Morelli and Claudio M. Villa
Thermal transient modeling and experimental validation in the European project profit SEMI-THERM Symposium at San Jose, CA, in March 2003, 2002
Eric Bosch and Mohamed-Nabil Sabry
Thermal compact models for electronic systems
SEMI-THERM Symposium at San Jose, CA, in March 2002, 2001
John Guarino and Vincent Manno
Characterization of laminar jet impingement cooling in portable computer applications SEMI-THERM Symposium at San Jose, CA, in March 2001, 2000
Marta Rencz & Vladimir Székely
Dynamic thermal multiport modeling of IC packages
THERMINIC workshop at Budapast, Hungary, in September 2000
Peter Rodgers
Validation and application of different experimental techniques to measure electronic component operating junction temperature.
John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka and Jukka Rantala
Transactions of IEEE CPMT, vol. 22, no. 2, June 1999, pp.252-258
Effect of PCB thermal conductivity on the operating temperature of an SO-8 package in a natural convection environment: experimental measurement versus numerical prediction.
John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager and Jukka Rantala
Proceedings of 5th THERMINIC workshop, Rome Italy, October 3-6, 1999, pp.207-213
Validating numerical predictions of component thermal interaction on electronic printed circuit boards in forced convection airflows by experimental analysis.
Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager and Jukka Rantala
Proceedings of InterPACK conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009
Impact of convective environment on the distribution of heat transfer from three electronic
component package types - operating on single and multi-component printed circuit boards.
Peter Rodgers, John Lohan, Valérie Eveloy and Carl-Magnus Fager
Proceedings of 5th THERMINIC workshop, Rome Italy, October 3-6, 1999, pp.214-220
Experimental validation of numerical heat transfer predictions for single and multi-component printed circuit boards in natural convection environments.
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64
Experimental validation of numerical heat transfer predictions for single and multi-component printed circuit boards in a forced convection environment: part 1 - experimental and numerical modeling.
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Experimental validation of numerical heat transfer predictions for single and multi-component printed circuit boards in a forced convection environment: part 1 - experimental and numerical modeling.
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Eric Eggink
Thermal management in industrial product development EUROTHERM seminar at Nantes, France, in September 1997
The Harvey Rosten Award for Excellence is supported by Mentor Graphics' Mechanical Analysis Division.