熱解析とシミュレーション

Conduction

Thermal conduction occurs when heat transfers through a solid, from the higher-temperature to lower-temperature regions. This happens spontaneously and continues until a state of thermal equilibrium is attained. Typical examples of conduction in everyday life include the handle of a pot of boiling water getting hot, the increase in temperature of the outer wall of a copper pipe as hot water passes through it, or the spontaneous chill you experience when you consume a spoonful of ice cream.

Understanding conduction behavior can help you design safer, more dependable and better performing products. Simcenter places robust conductive heat transfer analysis capabilities at your fingertips.

Radiation

Radiative heat transfer occurs when objects radiate electromagnetic energy due to temperature. This energy, typically located in the infrared region of the wave spectrum, is also known as thermal radiation.

Simcenter provides you with the capabilities to solve the most complex problems involving radiative heat transfer, such as sophisticated radiation analysis and radiative heating models. Advanced radiation methods such as deterministic and Monte Carlo ray tracing and nongray multiband radiative heat transfer are available.

Additionally, Simcenter can simulate thermal radiation effects orders of magnitude faster by using graphical processing units (GPUs) instead of using a computer processor unit (CPU).

CAD-CAE integration

Simcenter offers seamless CAD-CAE integration, empowering you to tackle complex thermal challenges with speed and precision. Its direct CAD associativity ensures instant updates to design changes, while advanced meshing and comprehensive thermal modeling—covering conduction, convection, radiation, and phase change—deliver accuracy. CAD-CAE integration helps to streamline design space exploration so you can quickly modify modeling features and automatically update your thermal simulation model. Simcenter not only accelerates workflows but also drives innovation, enabling teams to create smarter, more reliable thermal performance with confidence.

Design space exploration

Design space exploration revolutionizes thermal engineering by automating the evaluation of design variables, enabling rapid discovery of optimal solutions. It integrates multiphysics simulation, coupling thermal, structural, and fluid dynamics analyses, to address complex heat transfer challenges. Advanced optimization routines streamline the process and reduce reliance on manual trial-and-error processes. This boosts productivity, accelerates time-to-market, and enhances product reliability.

Thermal multiphysics analysis

Simcenter's multiphysics capabilities are essential because real-world engineering challenges involve interrelated physical phenomena. When a component heats up, it affects structural integrity, thermal contacts, and fluid dynamics simultaneously.

Simcenter streamlines these complex analyses through seamless integration, offering a unified platform that eliminates data transfer errors and reduces setup time. Its automated workflows and built-in solvers for thermal, structural, flow, and electromagnetic analyses work together efficiently. This integrated approach cuts analysis time by up to 70% compared to disconnected tools, enabling engineers to make better design decisions faster and create more reliable products.

Space systems thermal analysis

Simcenter provides a comprehensive set of tools to perform orbital thermal analysis integrated into your design and engineering process. It allows you to maximize efficiency with an automated solution that carries out the thermal analysis in a single pass.

Simcenter helps resolve engineering challenges early in the design process and is a valuable tool for predicting and understanding thermal physics for space-bound, orbiting and interplanetary vehicles.