Simcenter FLOEFD software

Our CAD-embedded CFD simulation software enables engineers to conduct fluid flow simulation and heat transfer analysis in the CAD design environment. It has an intuitive interface, and critically, uses CAD geometry directly. This eliminates the time overhead of CAD data translation. It also allows engineers to conduct multiple design studies and evaluate results to see how modifications to geometry or operating boundary conditions influence performance. This makes simulation results available earlier in development for better decision making, and it supports more seamless communication with other CAD-driven engineering functions.

The Simcenter FLOEFD automatic fluid volume detection and automated meshing techniques are designed to work directly with CAD geometry. It can handle complex or variable quality geometry without the need to simplify models. SmartCells Technology is at the core of efficient automatic meshing with the Simcenter FLOEFD robust cartesian immersed boundary grid method. SmartCells can resolve many solid and fluid regions accurately within a single cell, subdividing it into multiple control volumes for calculation. This is crucial to meshing complex CAD models, including automatically dealing with challenging conditions like interfering geometry or very thin volumes.  Simcenter FLOEFD applies automatic mesh refinement based on geometry features, and solution adaptive refinement can be enabled for efficient mesh resolution of regions with higher flow and thermal gradients. There are options available for local meshing and manual controls for engineers desiring more precise control of the mesh.    

Simcenter FLOEFD meshing and solver technology provides a unique combination of classic 3D finite-volume numerical approaches with empirical and analytical methods to simulate CFD problems. A comparatively coarse mesh can be generated quickly and easily, which is very efficient and stable to solve compared to typical CFD software, while still maintaining relatively high accuracy. 

A step change of going from days to hours, or hours to minutes for meshing is often reported when Simcenter FLOEFD is adopted. The innovative meshing technology of our CAD-embedded approach allows design engineers and non-specialists to reliably conduct CFD analyses early in the design process. It also provides a fast and efficient alternative approach for experienced analysts to tackle a wide range of typical CFD problems.

Simcenter FLOEFD incorporates a very capable and intuitive parametric study functionality. Use it to explore changes in model geometry or different operating scenarios through to design of experiments studies.

The compare configuration combined with the parametric study capabilities inside Simcenter FLOEFD enables engineers to more easily understand the influence of changes in the geometry and boundary conditions on the performance. Users can compare results by numerical values, graphs and visualized results and plots.

The three primary methods for design exploration include:

• 'What if' studies using a series of altered parameters to explore resultant designs using the compare tool to find the best solution yourself
• Goal-based optimization uses a range of variation for a single input variable to find the best design
• Design of Experiments (DOE) allows you to set a range of variation for a number of design variables and then solve a matrix of design points. You can then find the optimum design using the Response Surface interpolation method

Additionally, there is a Simcenter HEEDS plugin available which further enables engineers to perform design space exploration by using smart and efficient search and automation, and by leveraging the underlying proprietary Sherpa Algorithm. Simcenter HEEDS helps engineers to find design concepts that meet or exceed performance requirements quicker than traditional optimization approaches.

LED thermal management is important for ensuring correct lighting performance and for reliability. The Simcenter FLOEFD CAD-embedded CFD software enables lighting product design engineers to explore luminaire thermal designs early on and throughout development to avoid re-spins. 

Specific capabilities in the Simcenter FLOEFD LED module include combined thermal-electrical and photometric modeling of LEDs, and the ability to import your own LED models. You can model the LED component thermal behavior in detail to predict accurate LED junction temperature when powered under a forward current and the resulting operating light output (hot lumens) for the LED installed in a luminaire.  

Uniquely, Simcenter FLOEFD simulation can be combined with: measurement data for an RC-ladder compact thermal model from Simcenter Micred T3STER; and optical characterization data from Simcenter Micred LED Tester to provide the highest accuracy test data-based LED model for use in system level studies.

The LED module supports Monte Carlo radiation modeling for simulating absorption and scattering of radiation in semi-transparent solids such as glass, as well as considering the effects of refraction and specular reflection to wavelength dependency. For automotive lighting and other demanding applications, condensation modeling enables engineers to model the complexity of thin film condensation, evaporation, the influences of icing and water absorption for changes in humidity.

Simcenter FLOEFD enables thermal engineers and designers to work in the CAD environment to accelerate thermal design – for electronics cooling simulation to thermo-mechanical stress analysis.

Highlighted features include design stage appropriate options for thermal analysis of printed circuit boards (PCBs) from simple, detailed (layered) to explicit copper trace. The SmartPCB option, a computationally efficient modeling network assembly approach, does not sacrifice accuracy for thermal modeling that also supports electro-thermal co-simulation tasks and thermo-mechanical stress analysis. The Simcenter FLOEFD EDA Bridge supports easy PCB data import from all major EDA software file formats. Package modeling options including 2-Resistor, network assembly, and detailed models. It is possible to create these with all internal geometric elements included, in just minutes using the Package Creator utility.

Further capabilities include transient modeling and measurement calibration (with Simcenter Micred T3STER) to achieve the highest accuracy. Additionally, BCI-ROM technology enables you to generate reduced order models from 3D analysis for use in electrothermal circuit simulation and system simulation tools.

Learn about streamlining PCB thermal and thermo-mechanical analysis in this on-demand webinar.