Simcenter Micred Power Tester

Simcenter Micred Power Tester combines active power cycling with transient thermal characterization and thermal structure investigation. Perform the non-destructive structure-function assessment while the device is mounted, providing a full electrical and structural assessment of the device.

Rely on a reliable tool
The Simcenter Micred Power Tester supports automatic testing and diagnosis of possible failure causes of power components on the manufacturing floor. The energy demands of both consumer and industrial electronic systems are increasing, and power electronics component suppliers as well as OEMs are faced with the challenge of providing the highly reliable systems needed for aviation, electric vehicles, trains, power generation, and reusable energy production. The Simcenter Micred Power Tester can power the modules through tens of thousands, potentially millions, of cycles while simultaneously providing a real-time failure-in-progress diagnosis.

Receive real-time failure diagnosis
The Simcenter Micred Power Tester is the only machine built for manufacturing as well as laboratory environments that does automated power cycling while producing analytical data for real-time failure-in-progress diagnosis. It’s designed to perform lifetime testing to test the reliability of applications that use power electronic modules.

Accelerate the process
The Simcenter Micred Power Tester is unique since it provides fully automated power testing and cycling at the same time, on the same machine, without having to remove the device under test during the process. A simple touch-screen interface allows a technician to use it on the manufacturing floor and/or failure analysis engineer to use it in the lab.

Thermal testing

The family of thermal characterization hardware solutions provides component and systems suppliers with the ability to accurately and efficiently test, measure, and thermally characterize semiconductor integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics modules, thermal interface material (TIM) properties and complete electronic systems. 

Our hardware solutions directly measure the actual heating or cooling curves of packaged semiconductor devices continuously and in real time, rather than artificially composing this from the results of several individual tests. Measuring the true thermal transient response in this way is far more efficient and accurate, leading to more accurate thermal metrics than steady-state methods. Measurements only need to be performed once per sample, rather than repeated and an average taken as with steady-state methods.

Read more about thermal testing

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