Thermal analysis and simulation

Thermal conduction occurs when heat transfers through a solid, from the higher-temperature to lower-temperature regions. This happens spontaneously and continues until a state of thermal equilibrium is attained. Typical examples of conduction in everyday life include the handle of a pot of boiling water getting hot, the increase in temperature of the outer wall of a copper pipe as hot water passes through it, or the spontaneous chill you experience when you consume a spoonful of ice cream.

Understanding conduction behavior can help you design safer, more dependable and better performing products. Simcenter places robust conductive heat transfer analysis capabilities at your fingertips.

Convection is a major heat transfer pathway that is present in a wide range of applications, processes and natural phenomena. Many products rely on a robust heat management strategy for optimal performance and durability. Optimizing convective heat transfer in these devices, either by strategic placement of components or the use of other working fluids, is a complex problem. Simcenter offers robust capabilities for addressing convection in the design of products.

Radiative heat transfer occurs when objects radiate electromagnetic energy due to temperature. This energy, typically located in the infrared region of the wave spectrum, is also known as thermal radiation.

Simcenter provides you with the capabilities to solve the most complex problems involving radiative heat transfer, such as sophisticated radiation analysis and radiative heating models. Advanced radiation methods such as deterministic and Monte Carlo ray tracing and nongray multiband radiative heat transfer are available.

Simcenter provides a comprehensive set of tools to perform orbital thermal analysis integrated into your design and engineering process. It allows you to maximize efficiency with an automated solution that carries out the thermal analysis in a single pass.

Simcenter helps resolve engineering challenges early in the design process and is a valuable tool for predicting and understanding thermal physics for space-bound, orbiting and interplanetary vehicles.